Lantronix – Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects

Lantronix Inc. (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q™ family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice, and is offered in a Yocto Project environment suitable for developers to build an operating system based on the Linux kernel for their embedded and IoT devices. The SIP modules are powered by the Qualcomm® QRB2210 and Qualcomm® QRB4210 System-on-Chip (SoC) from Qualcomm Technologies Inc. Utilizing heterogenous compute capabilities with multiple specialized processing cores, they deliver high-performance computing with lower power consumption. https://www.lantronix.com/newsroom/press-releases/lantronix-introduces-new-open-q-family-sip-modules-deliver-high-performance-mass-market-robotics-iot-projects/